Pressure Test Assembly

During my internship at JetCool Technologies, I built a pressure-test assembly to evaluate the bond strength of different surface-area-enhancement geometries attached to a copper substrate for jet-impingement cooling. The goal was to determine the strength of the bond between the substrate and the surface area enhancement. I designed the aluminum test fixture, including the O-ring gland to Parker catalog specifications to ensure a proper seal during testing at 150 psi.

The surface-enhancement geometries themselves were produced separately and bonded to the copper coupons, while my assembly provided a repeatable way to mount and pressurize them for comparison. I created the CAM toolpaths in Fusion 360 and programmed the Tormach 1100MX CNC mill, set up each operation, and ran the machine. This project combined fixture design, sealing considerations, and precise machining, and it provided reliable test data to guide JetCool’s evaluation of new bonded cooling geometries.